Designing your carrier board – Congatec
Most interface circuitry is situated on the module, including PCI Express, Ethernet, SATA, display interfaces, general purpose I/O, and similar interfaces. The interfaces are routed to the appropriate ports on the carrier board.  The application-specific circuit parts are accommodated on the carrier board.  When designing your carrier board, you decide which of the electrically available computer properties you actually need and which extensions you want to develop.

Concept:

• CPU module with standard PC core functions
• Carrier board with customer specific function&size
• Logical alternative to a chip-down design effort

Benefits:

• Faster time to market
• Reduced development costs
• Scalable product range
• Allows customer focus on system features
• Faster reaction to market trends
• Second source philosophy
• Minimize inventory cost

Reduced risk:
COMs minimize risk. Basic changes during the design phase, or in the middle of a product‘s life cycle, are easily managed. Simply plug in the next-generation COM module and continue. COMs allow for easy upgrades

• Lower design risk
• Lower transition risk

Improved Flexibility:
COMs are flexible and can meet all performance requirements. The modules support a wide range of performance levels starting from NXP i.MX6 up to the Intel® Xeon® processor, as well as future architectures. The COM standards are well established and are already prepared for the future.

• Scalability
• Easy performance and technology upgrades

Time-To-Market Advantage:
COMs put you in a leading position. The use of customized carrier boards reduces necessary engineering effort by separating your design work from the embedded PC technology. Focus on your own core competency.

• Faster time to market
• Faster engineering
• Faster reaction time to market changes

10 examples Computer -on Modules – Congatec:
*   conga-SA7 SMARC 2.1 module based on Intel® Atom® x6000E and Intel® Pentium® and Celeron® J Series processors. Feature - see link

* conga-JC370 Highest Performance 3.5” Single Board Computer based on 8th Generation Intel® Core™ processor series called “Whiskey Lake”. Feature - see link

* Conga-TS370 Highest Performance 3.5” Single Board Computer based on 8th Generation Intel® Core™ processor series called “Whiskey Lake” Feature - see link

* Conga-MA7 COM Express® Mini Type 10 module based on Intel® Atom® x6000E, Intel® Pentium® and Celeron® J processor series. Feature - see link

*  Conga-B7AC COM Express Type 7 Basic module based on the latest Intel® Atom C3000 processor family. Feature - see link

*  Conga-SMX8 SMARC 2.0 module based on NXP i.MX8 ARM Cortex-A72, Cortex-A53 and Cortex-M4 processors. Feature -  see link

* Conga-QA5 Highest performance Qseven module with 5th Generation Intel® Atom™ / Celeron® / Pentium® processors. Feature - see link

* Conga-PA5 Pico ITX board based on 5th Generation Intel® Atom™ Processor.Feature - see link

*   Conga-TCV2 COM Express Type 6 Compact module based on AMD Embedded Ryzen V2000 embedded processor series. Feature see link

* conga-CEVAL Evaluation Carrier Board for COM Express® modules based on Type 2 pinout definition.
 Feature see link

Welcome to contact us at Recab for more info - info@recab.com
Recab
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SE – 126 30 Hägersten
Phone: + 46 8 683 03 00

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